Model NO.:FD-2535
Mode of Production: SMT
Base Material: FR-4
Customized: Customized
Trademark: PTS-LED
Specification: OEM
Metal Coating: Copper
Layers: Double-Layer
Certification: RoHS, CCC
Condition: New
Transport Package: Export Package
Origin: Shenzhen, China
Material:FR-4thickness:1.0mm
layer:6L
copper:1/1/1/1/1/1 oz
solder mask:green
silkscreen:white
finished surface:immersion gold
pth min hole:0.2mm
min trace/gap:4/4mil
blind hole:1-2layer,5-6layer,hole size:4mil
buried hole:2-5layer,hole size:0.2mm
pth hole:1-6layer
Product capability
Layers | Maximum Layer Count | 1~32 | tolerance |
Size | Maximum shipping Panel Size | 600mmx550mm | +/-0.15mm |
Board Thickness | Minimum Board Thickness | 0.4mm (4L)0.6mm (6L) | +/-0.1mm |
Maximum Board Thickness | 3.6mm | +/-10% | |
Copper Thickness | 0.5~5 oz | ||
Via Holes | Minimum Via | 0.2mm | PTH +/-0.075mm |
Buried Vias | Yes | NPTH +/-0.05mm | |
Blind Vias | Yes | ||
Ratio | Maximum Aspect Ratio | 10:01 | |
Trace | Minimum Line Width (Internal) | 0.075mm | The tolerance followed by IPC-6012 |
Minimum Line Spacing (Internal) | 0.075mm | ||
Minimum Line Width (External) | 0.075mm | ||
Minimum Line Spacing (External) | 0.075mm | ||
Surface Finish | Selective Soft Gold (MCM) | 0.025~0.1 um | |
SelectiveHard Gold (SIMM) | 0.025~1.0 um | ||
Immersion Gold (Ni/Au) | 0.025~0.1 um | ||
HASL | min. 2.5 um | ||
Lead Free HASL | min. 2.5 um | ||
OSP (Entek CU106A) | 0.2~0.5 um | ||
Immersion Tin | min. 0.625 um | ||
Immersion Silver | min. 0.175 um | ||
Carbon Ink | Yes | ||
Other Finish | Peelable mask | ||
Material | Composite | CEM-1 | |
CEM-3 | |||
Glass Fiber | FR-4 | ||
High Tg FR-4 | |||
Other Materials | Aluminum, Polyimide | ||
Solder Mask | LPI | Yes | |
UV | Yes | ||
Thermal | Yes | ||
Reliability | Controlled Impedance/tolerance | Yes | +/- 10% |
Ionic Contaminant | Yes | max. 1.56 ug/cm2 | |
Microsection | Yes | ||
Solderability Test | Yes | ||
Hi Pot Test | Yes | 500~1000V | |
Certificate | ISO 9000 | Yes | |
ISO 14000 | Yes | ||
TS 16949 | Yes | ||
UL | Yes |