· AXI PCB inspection: With density on PCBs increasing and new IC mounting technologies being used, not all solder joints may be visible. Particularly when new boards are being manufactured and new set-ups being used, it is very important to check that solder joints on packages such as BGAs (Ball Grid Arrays) are being correctly soldered. Optical inspection cannot achieve this because the solder joints are not visible. The only option is to use an X-Ray system - Automated X-Ray Inspection, AXI, that is able to look under the chips to view the solder joints. Although expensive and only used for a small proportion of the solder joints, etc, they are necessary in many instances.
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