LED Board PCBA FOR Urban Agriculture

LED Board PCBA FOR Urban Agriculture

Shenzhen Found Printed circuit Board co.,Ltd,established in 2010, has been playingleading role as a professional manufacturer of all kinds of highprecision PCBs in the past decades. With the ongoing investment in research, equipment and updating system of management, we have enjoyed a sound reputation in the field of PCB, and stand out in today’s market with fierce competition. Located in Shenzhen, our company has about 200 staff and a PCB workshop with about 8000 square meters. Our products are mostly used in the field of LED Linghting, and have good performance in all kind of functional test. Our perfect management, advanced equipments, and professional staffs are the keys for us to fight to win more market shares with other competitors. Customer‘s satisfaction and support are what we have been strived for. Now we have passed ISO9001, ISO14001, SGS and UL certificates. With constant hard work of our staff and ongoing support from customers both home and abroad, we can provide up to 24 layer, 6oz copper, High TG, AL-base to our customers with fast turn and high quality level.

Product Details

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PCB technologies commonly used for LED applications

 

- FR4 printed circuit board (PCB)

- FR4 PCB with thermal via array

- Thick copper PCB

- Integrated copper wires and profiles

- Insulated Metal Substrate (IMS)

- IMS with exposed copper

- Aluminum with thin insulation layer

- Thick/thin ceramics

FR4 printed circuit board (PCB)

 

Classic composite PCB of glassfiber and expoxy resin, available in various compounds, versions (single-/multilayer) and thickness (0.3-3.5mm)

 

Designation

Material

Note

FR4 Standard

Epoxy + glass fabrics

Tg=130-140C, RoHS/WEEE compliant

FR4 non-halogen

Epoxy + glass fabrics

Tg>150, CAF-resistant

FR4 mid Tg

Epoxy + glass fabrics

Tg: 140-160C, increased thermal stability, low elongation in z-axis, high steadiness at lead-free soldering, often CAF-resistant.

FR4 high Tg

Epoxy + glass fabrics

Tg: 160-190C, increased thermal stability, low elongation in z-axis, high steadiness at lead-free soldering, often CAF-resistant.


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