Product Description:
Quantity Prototype & Low Volume PCB Assembly & Mass production(MOQ=1)
Type of Assembly SMT,DIP&THT
Solder Type Water Soluble Solder Paste,Leaded and Lead-Free
Components Passive Down to 0201 size; BGA and VFBGA; Leadless Chip Carriers/CSP
Bare Board Size Smallest:0.25*0.25 inches ; Largest:20*20 inches
File Format Bill of Materials; Gerber files; Pick-N-Place file
Types of Service Turn-key,partial turn-key or consignment
Component Package Cut Tape,Tube,Reels,Loose Parts
Testing IQC; X-ray Inspection; AOI Test
PCBA Process SMT--Wave Soldering--Assembling--ICT--Function Testing
