Manufacture PCBA And SMT DIP Assembly

Manufacture PCBA and SMT DIP Assembly

Product Details

Manufacture PCBA and SMT DIP Assembly Specification 

PCB Capability:
 

Max layers number:40 layers
Min line width/gap:3mil/3mil
Min hole size for mechanical drill:0.15mm
Min hole size for laser drill:0.1mm
Min annular ring:4 mil
Max copper thickness:12oz
Max size for single and double layers PCBs:600 x 1200mm
Max size for multi-layers PCBs:500 x 1200mm
Board thickness for 2 layers:0.2-7.0mm
Board thickness for multi-layers:0.4-7.0mm
Min solder mask bridge:0.08mm
Aspect raion:15:01
Plugging vias capability:0.2-0.8mm
Impedance Control Tolerance:±10%
Thickness tolerance for PTH:+/- 3mil
Thickness tolerance for NPTH:+/- 2mil
Solder mask color:white,black,blue,green,yellow,red and so on
Character:White,yellow,black.
Finished surface:OSP(Entek),HASL,lead free HASL,ENIG(Immersion Gold),Immersion Tin,
Immersion Silver,Hard Gold,Platting Gold,Gold Finger,Enepig.
Month capability:5000 types/month. 6000m2/month
Normal board materials:SHENGYI,ITEQ,KB.
Special materials:ROGERS,ARLON,TACONIC,NELCO,ISOLA,HighTG:S1000-2.IT180

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Our Services:

PCB Design
PCB Manufacture (1-40 layers,FR4,High TG,Rigid-flex PCB,Aluminium)
Components Sourcing (100% guarantee original parts from authorized distributors)
PCB Assembly (SMT,DIP,BGA,QFN)
Conformal Coating
Functional Test
Final Product Assembly


Welcome to our cooperation!


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