Irregular Hybrid Cars PCBA

Irregular Hybrid cars PCBA

Product Details

PCB Technical standard: 
 

Shenzhen Found printed circuit Board Co.,LTD
SeqItemcapability
1Base MaterialFR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc
2Layers1-40 ( ≥30 layers needs review )
3Finished inner/outer copper thickness0.5-6OZ
4Finished board thickness0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL
Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
5Max panel size≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm
6Min conductor line width/spacingInner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil
7Min hole sizeMechanical hole: 0.15mm
Laser hole: 0.1mm
Drilling precision: first drilling       First drilling: 1mil
                                                     Second drilling: 4mil
8WarpageBoard thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5%
9Controlled Impedance+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review)
10Aspect Ratio15:01
11Min welding ring4mil
12Min solder mask bridge≥0.08mm
13Plugging vias capability0.2-0.8mm
14Hole tolerancePTH: +/-3mil
NPTH: +/-2mil
15Outline profileRout/ V-cut/ Bridge/ Stamp hole
16Solder mask colorGreen,yellow,black,blue,red,white,matte green
17Component mark colorwhite,yellow,black
18Surface treatmentOSP: 0.2-0.5um
HASL: 2-40um
Lead free HASL: 2-40um
ENIG: Au 1-10U''
ENEPIG: PB 2-5U''/ Au 1-8U''
Immersion Tin:0.8-1.5um
Immersion silver: 0.1-1.2um
Peelable blue mask
Carbon ink
Gold plating: Au 1-150U''
19E-TestFlying probe tester : 0.4-6.0mm,max 19.6*23.5inch
Min spacing from test pad to board edge : 0.5 mm
Min conductive resistance :   5 Ω
Max insulation resistance : 250   MΩ
Max test voltage : 500 V
Min test pad diameter : 6 mil
Min test pad to pad spacing : 10 mil
Max test current   :   200 MA
20AOIOrbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch
Orbotech Ves machine :   0.05-6.0mm,max 23.5*23.5inch

~32B0D1TC`4LGTU{R(LJA_APCB Manufacturing Capacity:
Base material:FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc
PCBs: Rigid(0-22layers),Flexible(1-8layers),Rigid-flex(1-16layers,flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness: 0.2mm--10mm
Copper thickness: 0.25 Oz -8 Oz
Max Panel Size: 1500 mm × 560 mm
Min. Hole Size: 0.075mm(3mil)
Min. Line Width/Spacing: 3mil
Surface Finishing: HASL/HAL, HASL Lead Free,ENIG,immersion silver,immersion tin,OSP,Plating Hard Gold,etc.
Solder Mask Color: White, Black, Yellow, Green, Red, etc.
Silkscreen Color: Black, White, Yellow, Red, Blue, etc.
Special Process: Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
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Full Range Of Testing Services: 

▪AOI

▪Function testing
▪In circuit testing
▪X-ray for BGA testing
▪3D paste thickness test
▪Flash testing and earth bonding tests can also be undertaken where required
Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested

Welcome to our cooperation!

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