FR4 PCB Assembly Board

FR4 PCB Assembly Board

PCBA Technologies: BGA, Micro BGA Flip Chip, Chip On Board (COB) Tape Automated Bonding (TAB) Bare die wire bond PCMCIA Flying probe Selective Solder Surface Mount Capabilities: PCBA for a wide range of volume, mix and complexity requirements No clean or aqueous solder process Fine pitch screen...

Product Details

PCBA Technologies:

  • BGA, Micro BGA

  • Flip Chip, Chip On Board (COB)

  • Tape Automated Bonding (TAB)

  • Bare die wire bond

  • PCMCIA

  • Flying probe

  • Selective Solder

Surface Mount Capabilities:

  • PCBA for a wide range of volume, mix and complexity requirements

  • No clean or aqueous solder process

  • Fine pitch screen printing/placement down to 8 mil (.008")

  • Odd form part placement

  • Mixed technology

  • Mil-Spec

  • 01005 and 0201 Chip Components

  • MELFs


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