For laser cutting or drilling PCB industry, only a few or more than 10 watts of UV laser can, without kw level of laser power, in consumer electronics, automobile industry or manufacturing technology of the robot, the use of the flexible circuit board is becoming increasingly important.Due to the UV laser processing system has a flexible way of processing, high precision machining effect and flexible and controllable process, thus become the flexible circuit board and thin PCB laser drilling and cutting of choice.
Today, laser system configuration of long life laser source is basically close to maintenance, in the production process, laser level is level 1, safety does not need other protection devices.The LPKF laser system is equipped with a vacuuming device that does not cause harmful emissions.With its intuitive and easy-to-use software control, laser technology is replacing the traditional mechanical process, saving the cost of special tool.
CO2 laser or UV laser?
For example, when PCB is split or cut, the wavelength is about 10.6. The CO2 laser system of mu m.Its processing cost is relatively low, the laser power that provides can reach several kilowatts.But it produces a lot of heat in the process of cutting, resulting in severe carbonization of the edges.
UV laser wavelength is 355 nm.This wavelength of laser light is very easy to focus on.The UV laser with a laser power of less than 20 watts has a diameter of only 20 m - and its energy density is even comparable to that of the sun.
UV laser processing advantage.
UV laser is especially suitable for the cutting and marking of hard plate, soft and hard board, soft board and auxiliary materials.So what are the advantages of this laser technology?
The UV laser cutting system shows great technical advantages in areas such as the PCB boards in SMT industry and microdrilling in PCB industry.Depending on the thickness of the PCB material, the laser is cut along the required profile once or more.The thinner the material, the faster the cutting speed.If the accumulated laser pulses are lower than the laser pulses needed to penetrate the material, only scratches will appear on the surface of the material.Therefore, the marking of qr code or bar code can be carried out on the material so as to follow the information of the subsequent process.
UV laser pulse energy on the material only microsecond time, beside the incision JiWei meters, there is no heat affected obviously, there is no need to consider the heat damage of components.Lines near the edge and solder joints are intact, without burrs.
In addition, LPKF UV laser system integration CAM software can directly import the exported data from the CAD, edit for laser cutting paths, forming laser cutting contour, processing parameter database, choose suitable for different material can directly laser processing.The laser system is suitable for mass production and production.
Soft and hard binding plate processing.
In the soft and hard bonding board, the rigid PCB and the flexible PCB are pressed together to form a multilayer board.Pressing process, the flexible PCB is not above the rigid PCB pressing and bonding together, through laser cutting depth to cover lid on flexible PCB rigid cutting, separation, leave a flexible part, combined with hard and soft formation plate.
This kind of deep processing is also suitable for the blind groove processing of the surface embedded integrated elements in the multi-layer plate.The UV laser will precisely cut the blind slot
Cutting breakpoint splitter, the laser system cuts the connection point through a process described above.This cutting process can be close to the edge of the components, for thicker circuit board is also very economical.
Due to the short wavelength of UV laser, it can be applied to most materials processing.For example, it can be used in the field of electronic industry:
Processing TCO/ITO glass with no damage to the base.
To drill holes in flexible or thin materials.
Resistance welding layer or covering film opening.
A rigid flexible/flexible circuit board.
The repair of the assembly or unassembled circuit board.
The cutting of sintering ceramics.
Precision cutting LTCC.
UV laser processing application in PCB industry.
The UV laser system can also complete the cutting, direct writing and drilling of LTCC components in a processing operation.