TraX Invests In RF And High-speed Digital PCB Capability

- Sep 01, 2018-

blob.png

As technology advances annually, so do the laminates and materials used in the manufacture of printed circuit boards. These new laminates each bring different challenges during the manufacturing process due to their chemical composition and the specialised electrical properties they are designed to achieve. Many of these laminates require special processing and special equipment, especially the PTFE low-loss materials utilised in radar and RF applications. The modern challenges involved have led TraX Interconnect to add an MEC V-Bond process to its list of capabilities.