Taiwanese PCB Output Hit Another High In The First Half

- Aug 28, 2018-

The output value of printed circuit board (PCB) produced by Taiwan merchants on both sides of the Taiwan straits and foreign businesses in Taiwan in the first half of 2018 was 287.8 billion yuan (nt $, the same below), up 9 percent year on year, reaching a record high in the same period of previous years.

Output growth in the first half of the PCB, the main communications products and server needs good, PC shipments rose slightly in the second quarter, including the related computer sandwich plate and memory load plate and the module with the demand of circuit board, in the context of individual products, soft board, hard and soft board and HDI board shipments increased nearly twenty percent in the best performance.

Engineering institute analyst zhong dong Ming pointed out that the international monetary fund (IMF) announced July forecast for global growth rate, to 3.9% in 2018 and 2019, April forecast of the figures are the same with previous, appeared global growth gradually improve visibility, but because of the international situation there are still many unstable factors, such as sino-us trade war, emerging countries strictly on the financial crisis, China pollution limit, etc., even if the market looks optimistic, but there are also many concerns.

Zhong dong Ming further pointed out that although the second half into the traditional peak season, but because of the base period last year, compared to last year, the average unit price plus Apple, new circuit boards iPhone X decline, including class load board, as well as the combination of hard and soft board, so the effect of the second half of the calendar year to drive growth of Apple, new strong fear than last year, estimates 2018 annual production value of 630.8 billion yuan, annual growth of 2%, still is expected to hit a historical high.

In view of new technology applications in the next few years, the industry proposes that market opportunities in the future will be in artificial intelligence (AI) and high-speed 5G communication applications.The future development of AI must meet the requirements of machine-processable, analyzable big data and implementation update and improvement. The onboard board will have the design requirements of more fine line. 5G application emphasizes the reliability of high-frequency and high-speed PCB materials and electrical characteristics.