Specifications | Details |
Material type | FR-1,FR-4, CEM-1, aluminum clad, |
Material thickness ( mm) | 0.4,0.6,0.8,1.0,1.2,1.6,2.0 |
Layer count | 1 to 8 layers |
Max. board size | 23.00" x 35.00"(580mm*900mm) |
IPC class | Class II, Class III , Class 1 |
Annular ring | 5 mil/side or Greater (Min. Design) |
Finish plating | Solder(HASL), lead free solder(HASL), ENIG (electroless nickel immersion gold), OSP, immersion silver, immersion tin, immersion nickel, hard gold, other |
Copper weight | 0.5OZ-2OZ |
Trace/space width | 3 Mils or greater |
Drill clearance | 0.1mm(laser drilling) |
Plated slots | 0.036 or Greater |
Smallest hole (finished) | 0.1mm or greater |
Gold fingers | 1 to 4 Edge (30 to 50 Micron Gold) |
SMD pitch | 0.080" - 0.020" - 0.010" |
Solder mask Type | LPI glossy, LPI-Matte, SR1000 |
Solder mask Color | Green, red, blue, black, white, yellow, |
Legend color | White, yellow, black, red, blue |
CNC route point | Any |
Minimum route width | 0.031" |
Scoring | Straight lines, jump scoring, panel edge to edge, CNC* |
Body gold | Hard*, immersion* (up to 50 micron gold) |
Data file format | Gerber 274x with embedded aperture |
Fab. drawing format | DXF, HPGL, DWG, PDF, Gerber |
E.t testing | Flying probe, single sided, 1up plate, clamp shell, net list |
Counter sink/counter bore | Available up to 0.250 diameter |
Control impedance | Yes |
Blind vias/buried vias | Yes |
Peelable mask | Yes |
Carbon | Yes |