Led Aluminum Substrate Features And Specification Requirements

- Jan 27, 2018-

1. Surface mount technology (SMT);

2. Extremely effective treatment of thermal diffusion in circuit design scheme;

3. Reduce the operating temperature of the product, improve the product power density and reliability, and extend the service life of the product;

4. Reduce the volume of products and reduce hardware and assembly costs;

5. Replace fragile ceramic substrate to obtain better mechanical endurance.

The structure of aluminum substrate.

Aluminum - based copper clad plate is a kind of metal circuit board material, composed of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:

Cireuitl.Layer: copper clad with common PCB, with copper foil thickness loz to 10oz.

DiELcctricLayer insulation: insulation layer is a layer of low thermal conductive insulation material.

BaseLayer base: metal substrate, usually aluminum or optional copper.Aluminum - based copper clad plate and traditional epoxy glass cloth laminate.

Circuit layer (that is, the copper foil) usually formed after etching printed circuit, the component parts of the mutual connection, under normal circumstances, the circuit layer with a lot of current-carrying capacity, thus should use thicker copper foil and the thickness of the general 35 microns to 280 microns;Thermal insulation is aluminum plate core technology, it is usually made up of special ceramics fill special polymer, small heat resistance, excellent viscoelasticity can, has the ability of thermal aging, able to withstand mechanical and thermal stress.

The thermal insulation layer of high performance aluminum substrate USES this technology, which makes it have excellent thermal conductivity and high strength electrical insulation performance.Metal base is aluminum plate support components, requires high heat conductivity, generally is aluminum plate, also can use copper (copper plate can provide better thermal conductivity), suitable for drilling, punching and shearing and cutting and other conventional mechanical processing.Compared with other materials, PCB materials have incomparable advantages.Suitable for SMT on the surface of power components.Without radiator, the volume is greatly reduced, heat dissipation is excellent, good insulation and mechanical properties.

Iii. Use of aluminum substrate:

Purpose: power mixing IC (HIC).

1. Audio equipment: input, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc.

2. Power equipment: switching regulator ` DC/AC converter ` SW regulator, etc.

3. Communication electronic equipment: high frequency increase ` filtering electrical ` transmitting circuit.

4. Office automation equipment: motor drive, etc.

5. Car: electronic regulator ` igniter ` power controller, etc.

6. A computer: CPU board ` diskette drive ` power supply device, etc.

7. A power module: inverter ` solid relay ` rectifier bridge, etc.