Introduction To High Density Interconnection (HDI).

- Jan 17, 2018-

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High density interconnection (HDI) manufacturing is one of the fastest growing areas in PCB industry. From HP in 1985 launched the first 32 bit computer (Finstrate), until now the 36 order laminated multilayer PCB and stack type micro hole big client server, HDI/tiny hole technology is undoubtedly the PCB architecture in the future. Spacing is smaller, the I/O pins and embedded passive components more large ASIC and FPGA has more and more short rise time and higher frequency, they require more PCB features of small size, has been driven by a strong demand for HDI/tiny hole. This paper briefly introduces six simple processes in the process of building high reliability HDI/ micro overhole and the need for improved PCB manufacturing process.