Apple's New OLED IPhone

- Oct 17, 2018-

Apple's next OLED iPhone has decided to reduce the use of hardcopy software (RFPCB) and replace it with cheaper and less advanced multi-fpcb.

Apple's next OLED iPhone has decided to reduce the use of hardcopy software (RFPCB) and replace it with cheaper and less advanced multi-fpcb.

The Investor, a south Korean website, reports that RFPCB is a key component that connects The iPhone X's embedded chips and panels, and that touch panels for The new OLED iPhone, due to be released in September, may feature multilayer flexible printed circuit boards, mostly taking into account price and production.

The country's three biggest PCB makers, LG Innotek, Interflex and sinopac, all supply RFPCB, but apple also faced a series of early problems in adopting RFPCB, such as failing to win orders from a factory before the launch of the iPhone X.

A key cause of the iPhone X's previous cold shutdown was a connection problem with the RFPCB module, which led to a major investigation by apple and led to a brief shutdown of some parts suppliers.

What remains to be seen is whether apple will require existing suppliers to switch to multilayer flexible printed circuit boards, or increase supply, or directly replace suppliers.A PCB business, according to south Korean previously considered provides multi-layer flexible printed circuit board for apple, but for apple proposed price is too low and forget about it.

Three new iphones apple will be published this year, a LCD and two OLED respectively the iPhone, and 5.85 inches and 6.46-inch OLED panels are supplied by samsung display (SDI).