Analyze The Difficulties And Trends Of Mini LED Technology

- Nov 03, 2018-

As as a decline in the cost of the LED chip and the advancement of technology, coupled with the recent growth LED lighting industry, LED chip and packaging companies at home and abroad to start looking for new market growth, Mini&Micro LED as a new technology, market prospect of nearly two years especially attention, Micro LED current uncertainty because of technical route and the cause of the high cost, short period of time is difficult to large-scale commercial, and MiniLED as an extension of the small spacing LED products and LED a prelude to a Micro,The products of LCD backlight and RGB display have begun to be shipped. The Mini LED of P0.9 that has been produced in volume at the present stage, because the chip, equipment and manufacturing process are carried to the LED display with small spacing, thus effectively guaranteeing the high cost performance and the feasibility of mass production.

 Chip end

A miniaturized chips, as a result of the Mini LED for pixel spacing below 1 mm, it also requires the Mini LED chip also needs to be smaller, the Mini LED chip universal demand below 200 um, photolithography and etching in the process of the LED chip production put forward higher requirements, especially the existing mature production equipment is difficult to meet the chip production under 100 um, in the case of small size chips, welding surface roughness, the design of electrode structure, easy to weldability and the welding parameters of adaptability, assembly tolerance are emphasis and difficulty of chip design.In the production process of Mini LED chip, the full test and full score mode with low operating efficiency is also adopted. For dealing with a large number of high-density and high-precision chips, low efficiency exists in both production and detection, which virtually drives up the cost of Mini LED chip.

B, red flip chip, as a result of flip chip without lineup, suitable for the Mini LED ultra small space with demand, therefore the current Mini LED all adopt the flip chip structure, the blue-green flip LED chip production is relatively mature, but red flip LED chip, high technical difficulty, due to the substrate transfer is required, and the chip production yield in the process of transfer of technology and the reliability is not high.

C, consistency and reliability of the Mini LED chip as a display chip higher requirements for product consistency and reliability, and consistent focus on indicators include small current consistency, no electricity flow uniformity, high consistency, color uniform consistency, small capacitance and consistency, and due to the complexity of the Mini LED display screen using the environment, the maintenance difficulty is higher, the higher requirements on the reliability of the Mini LED chips, on the whole the Mini LED chip production enterprises in the process of production strict control of the production in order to ensure stable product of the indicators;

PCB back

On the premise of the Mini LED light, display and backlight effect of high demand on the thickness of the PCB back uniformity, smoothness, alignment and machining accuracy are put forward new challenges, coupled with the PCB on the back there are a large number of LED chips and driver IC, which requires the back Tg point higher than 220 ℃, and the PCB back need to be in the process of the Mini LED processing all kinds of external force, in order to keep back the thickness uniformity, dimensional stability, etc., also need the back has high resistance to tear strength and physical properties such as resistance to hot and humid.

In order to expand the application of Mini LED, the upstream and downstream manufacturers of Mini LED industry are actively striving to develop new technologies and reduce costs. At present, domestic and foreign Mini LED manufacturers are focusing on the development or expansion of new technologies, including optical control chip, COB and IMD package, Mini LED massive transfer, TFT circuit backplate, flexible substrate, etc.