Printed Circuit Boards today face an ever-increasing demand in capabilities including high speed, low weight, higher component density, miniaturization, and more. Multi-layer PCBs can help meet those increased demands. Although they are not simply laid one on top of the other, a multi-layer pcb is created from two or more PCBs stacked together. Instead, additional dielectric material will connect the PCBs according to predetermined standards.
A well-designed “stackup” (the arrangement of layers that make up a PCB) can reduce some of the factors that can impact signal quality including: external noise, impedance mismatch, radiation, and signal cross talk.
Today’s article will look at some requirements to consider when designing a successful multi-layer PCB.
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