3D Printer Controller Pcb Ims Leiterplatten Lamp Thick Aluminium

3D Printer Controller Pcb Ims Leiterplatten Lamp Thick Aluminium

SHENZHEN FOUND PRINTED CIRCUIT BOARD is a professional pcb manufacturerhas over 20 years experience; we are specialized in producting single-sided, double-sided and multilayer printed circuit boards in china. Our products are widely used in Automotive electronics,Industrial equipment,Medical tools,Power Meter,Consumers electrionics and Security control ect;With rich experience of in this line, we will show you weare your reliable PCB supplier.

Product Details

  • Model NO.: FD-6563

  • Application: Consumer Electronics

  • Processing Technology: Electrolytic Foil

  • Base Material: Aluminum

  • Brand: FD

  • Board Layer: 2 Layers

  • Trademark: UC

  • Specification: UL, RoHS, SGS,

  • HS Code: 8534009000

  • Structure: Double-Sided Rigid PCB

  • Material: Epoxide Woven Glass Fabric Laminate

  • Flame Retardant Properties: V0

  • Production Process: Subtractive Process

  • Insulation Materials: Epoxy Resin

  • Lead Time: 6 Working Days

  • Transport Package: Vacuum Package

  • Origin: Shenzhen, China

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ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz
Outer copper thickness0.5~6 oz
Finished board thickness0.4-3.2 mm

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation
Layer count Capability1-30 LAYER
alignment between ML±2mil
Min drilling0.15 mm
Min finished hole0.1 mm
Hole precision±2 mil(±50 um)
tolerance for Slot±3 mil(±75 um)
tolerance for PTH±3 mil(±75um)
tolerance for NPTH±2mil(±50um)
Max Aspect Ratio for PTH8:1
Hole wall copper thickness15-50um
Alignment of outer layers4mil/4mil
Min trace width/space for outer layer4mil/4mil
Tolerance of Etching+/-10%
Thickness of solder maskon trace0.4-1.2mil(10-30um)
at trace corner≥0.2mil(5um)
On base material≤+1.2mil
  Finished thickness

Hardness of solder mask6H
Alignment of solder mask film±2mil(+/-50um)
Min width of solder mask bridge4mil(100um)
Max hole with solder plug0.5mm
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger280u"(7um)
Max gold thickness for Gold finger30u"(0.75um)
Nickel thickness in Immersion Gold120u"/240u"(3um/6um)
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength≥61B/in(≥107g/mm)
bow and twist
 
0.75%


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