Metal Core Aluminum Base PCB With Immer Tin Surface

Metal Core Aluminum Base PCB With Immer Tin Surface

Model NO.: FD-66 Processing Technology: Delay Pressure Foil Base Material: Copper Insulation Materials: Metal Composite Materials Brand: ZH Copper Thickness: 1oz Board Thickness: 1.6mm Trademark: FOUND Transport Package: Packing Specification: 200X150MM Origin: China HS Code: 8534009000

Product Details


metal_core_aluminum_base_pcb_with_immersion_tin_surface_finish.jpg

Model NO.: FD-66

Processing Technology: Delay Pressure Foil

Base Material: Copper

Insulation Materials: Metal Composite Materials

Brand: ZH

Copper Thickness: 1oz

Board Thickness: 1.6mm

Trademark: FOUND

Transport Package: Packing

Specification: 200X150MM

Origin: China

HS Code: 8534009000


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