MC PCB Aluminum Bergquist T-Clad Ims PCB

MC PCB Aluminum Bergquist T-Clad Ims PCB

Model NO.: FD-10 Dielectric: FR-4 Application: Medical Instruments Mechanical Rigid: Rigid Base Material: Aluminum Brand: LD Transport Package: Packing Origin: China Type: Rigid Circuit Board Material: Fiberglass Epoxy Flame Retardant Properties: HB Processing Technology: Delay Pressure Foil Insulation Materials: Organic Resin Trademark: FOUND Specification: 100X150MM HS Code: 8534009000

Product Details

MC PCB Bergquist 

Aluminum substrate is a kind of copper plate with good heat dissipation function. It is composed of a unique three-layer structure, which is the circuit layer, thermal insulation layer and metal base.Surface-mount devices during the circuit layer, the heat generated by the runtime conduct through the insulation layer to the metal base, then the external metal substrate to spread to the module, to achieve heat dissipation on the device.

Compared with the traditional fr-4, the aluminum substrate can reduce the thermal resistance to the lowest, so that the substrate has excellent heat conduction performance.Compared with thick film ceramic circuit, its mechanical properties are excellent.

Shenzhen Found aluminum substrate USES a high quality insulation layer, which has excellent thermal conductivity and good electrical insulation strength.Among them, LED-0602 thermal conductivity 1.1W/m·K, puncture 5KVAC;IMS - h01-2 coefficient of thermal conductivity is 1.1 W/m K, breakdown voltage 6 kvac, has received industry is demanding 130 ℃ of UL certification, all performance can ensure long-term running module at 130 ℃.

Insulating layer on the domestic market at present most of the aluminum plate adopted commercialized FR - 4 and a half solidification, such as insulating all consists of epoxy resin, although this kind of insulation adhesive has good performance, but because they didn't add the high thermal conductivity, high insulating ceramic filler, the thermal resistance of this kind of aluminum plate (coefficient of thermal conductivity is only 0.3 W/m, K), if you use this kind of aluminum plate, the heat generated by the high power density module is very difficult to conduction to the metal substrate, such heat accumulation can accelerate power modules aging and eventually lead to failure.And this kind of aluminum substrate dielectric strength limited (2 kv AC) or less, it is difficult to meet the needs of safety testing, can only be applied to the low power density, for the high power density module, it is hard to do, there is a great hidden trouble.


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Model NO.: FD-10 Dielectric: FR-4 Application: Medical Instruments Mechanical Rigid: Rigid Base Material: Aluminum Brand: LD Transport Package: Packing Origin: China Type: Rigid Circuit Board Material: Fiberglass Epoxy Flame Retardant Properties: HB Processing Technology: Delay Pressure Foil Insulation Materials: Organic Resin Trademark: FOUND Specification: 100X150MM HS Code: 8534009000

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