Layers: 2 layer board,
Materials: Aluminum + FR-4 East of EPA-M2
Finished board thickness:2.0mm
Min hole size: 1.0mm
Surface treatment: Hasl Lead free
In a ‘Hybrid’ IMS construction a “Sub-assembly” of a non-thermal material is processed independently and then bonded to the aluminum base with thermal materials. The most common construction is a 2-Layer or 4-Layer Sub-assembly made from conventional FR-4. Bonding this layer to an aluminum base with thermal dielectrics can help dissipate heat, improve rigidity and act as a shield. Other benefits include:
Less costly than a construction of all thermally conductive materials
Provides superior thermal performance over a standard FR-4 product
Can eliminate costly heat sinks and associated assembly steps
Can be used in RF applications where a surface layer of PTFE is desired for its’ loss characteristics.
Use of component windows in the aluminum to accommodate through-hole components. This allows connectors and cables to pass connections through the substrate while the solder fillet creates a seal without the need for special gaskets or other costly adapters.
Common in the high performance power supply market, multilayer IMS PCBs are made from multiple layers of thermally conductive dielectrics. These constructions have one or more layers of circuitry buried in the dielectric with blind vias acting as either thermal vias or signal vias. While more expensive and less efficient at transferring heat as a single layer designs, they provide a simple and effective solution for heat dissipation in more complex designs.