Electronics in automobiles have grown substantially in the last decade and are only expected to increase as cars become more intelligent, energy-efficient, safer and more comfortable. With more function comes the need for more advanced electronics, which require high-reliability materials that can cope with a variety of automotive applications. Henkel offers experience in multiple formulation techniques – for example, marrying adhesive performance with thermal control in hybrid materials – and is providing superior value to automotive manufacturers as they consider next-generation designs. From under-the-hood control to in-cabin comfort, entertainment and safety to exterior lighting, keyless entry and tire sensors, Henkel materials have automotive electronics manufacturers covered -- bumper to bumper.
When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol® line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturing.