Standard specification for single-sided printed circuit board

- Sep 15, 2018-

Standard specification for single-sided printed circuit board

1, the purpose,

The specification specifies the inspection standard for single-sided printed circuit boards produced for the purpose of ensuring their quality.

2. Applicable order

When shipping check, individual specification should take precedence over this specification.

3. Reference standards

(1) inspection specification for single-sided printed circuit board of Toshiba tds-23-58-1 company

(2) testing of copper foil laminate for jis-c-6481 printed circuit boards

(3) jis-c-1052 printed circuit board test method

(4) gb10244-88 standard for printed boards for broadcast receivers

(5) acer computer IQC PCB inspection specification 96-8-12

(6) inspection specification of paper-based PCB of zhaohe electric power cable co., LTD

(7) inspection specification of 96-5-6 single-sided printed circuit board of panasonic electric company

4, definitions,

(1) fatal defects: due to its poor quality, there will be significant impact, possible damage, endangering people's life, other equipment, other lines, etc., which must be completely eliminated.

(2) heavy defect: the printed circuit board cannot be used for the purpose of the period due to its poor quality.

(3) minor defects: the poor quality of printed circuit board may reduce the performance and life of printed circuit board.

(4) minor defects: poor quality will reduce the value of goods, but will not affect the performance and life of printed circuit board.

(5) conical hole: as the gap between the upper and lower holes of the stamping model is too large, the cross section of the holes of the parts after punching and punching is the shape of the horn that extends to the assembly side of the parts.

(6) MT surface: component assembly surface

(7) PT surface: welding surface

5. Check the items and specifications

5.1 establishment of control

Poor quality level of project specification

5.1.2 labeling of individual specifications.Heavy defects

Label (1) printed circuit board parts code number (MT surface)

(2) printed circuit board parts code number (PT surface)

(3) enterprise logo

(4) basic material name and flame retardant grade of printed circuit board

5.1.2 defects shown on the following drawings as indicated in individual specifications

Shape (1) back diagram (PT surface)

(2) back part welding drawing

(3) surface graphics (MT surface)

(4) surface welding diagram (perforation diagram)

(5) printing drawings on the back

(6) printing drawings of surface text

(7) aperture size drawing

5.1.3 implement surface treatment defects specified in individual specifications

Surface treatment (1) preflux

(2) outer coating

5.1.4 materials specified in individual specifications

Material (1) printed circuit board with copper foil laminate

(2) soldering ink

(3) pre-flux

(4) text ink

(5) carbon and silver coating

(6) others

5.2 appearance

Poor quality level of project specification

5.2.1 (1) there shall be no light defect of more than 2/3 of a length of line width on a conductor with a depth of 10 (1) x (1) m

A scratch with a width of 1.0mm or more.

(2) there shall be no visible damage to the appearance of the wound and so on.

5.2.2 (1) the cable width shall not be more than 2/3 of the gap and heavy defects on the wire

(2) if the gap is caused by the mold, the gap shall not exceed 1/3 of the wire width

The above.

(3) no apparent damage to the appearance of the gap.(sometimes there are certain limits

The sample).

5.2.3 the copper foil, base material and soldering ink shall not have any air bubble defect

Air bubbles

5.2.4 no holes to holes shall be continuously whitened (interlayer stripping) and dense bleaching.Light defect

white

5.2.5 there shall be no copper foil peeling (hand thorn) around the connecting plate.Light defect

peeling

5.2.6 there shall be no harmful gap in practice.Heavy defects

Printed circuit

Plate gap

5.2.7 when the distance between the holes C shown in the following figure is less than 65% of the plate thickness, or the shape weight defect

When the distance between the crack and hole d is below the thickness of the plate, only one side of the crack can be allowed.

However, there shall be no other kinds of cracks.

Poor quality level of project specification

5.2.8 insect corrosion (debris accumulation) around the substrate should be below 0.3mm.Heavy defects

layered

5.2.9 no blockage shall be allowed.Heavy defects

Pore blocking

5.2.10 do not have any garbage or dirt that is harmful in practice.Light defect

Garbage, dirt

5.2.11 discoloration shall not be harmful in practice.Heavy defects

The so-called practical definition of discoloration of copper foil is based on the weldability of 5.4.4.

5.2.12 (1) the ink adhesion outside the connecting plate can make all kinds of marks easy to identify and free from defects

The ink adheres to an obviously harmful appearance.

(2) when the ink is attached inside the connecting plate, the longest is below 0.2mm.(figure A)

(3) ink should not be attached around the connecting disc hole.(diagram B -)

5.2.13 (1) heavy defects in copper foil of two opposite conductors spaced below 1mm

Soldering ink exposure.

(2) the exposure of wire copper foil should be less than 0.1mm in width;Length should be

Disappear and peel off below 0.5mm.

(3) the single-side area exposed to copper foil is the same as the single-side area of printed circuit board

Should be less than 0.5%.

5.2.14 for each 100mm x 100mm area of printed circuit board, two non-heavy defects appear

Vague and legible signs should be in one or more of the following.

Disappear, flaking however, the following signs need to be fully legible.

Seepage (1) printed circuit board part code number

(2) security specification mark (ID mark)