Direct growth of a local conductor line with a chemical copper layer on the surface of a non-conducting substrate assisted by an additional resistive agent (detailed in PCB, no. 47, p.62).The addition method used in PCB board can be divided into different ways, such as total addition, half addition and partial addition.
Backpanels, Backplanes support panels
A thick (e.g., 0.093 ",0.125 ") circuit board specially designed to connect other boards.The practice is to insert the multi-pin Connector first in the tight through-hole, but not solder, and then wire one by one through the guide pins that the Connector passes through the board.The connector can be inserted into the general PCB card.As a result of this kind of special board, its through hole can not solder tin, but let hole wall and guide needle directly tighten up use, its quality and aperture demand is particularly strict, its order quantity is not very much again, general circuit board factory is unwilling also not easy to receive this kind of order, become a kind of high grade specialized industry almost in the United States.
Build Up Process layer adding Process
This is a new field of thin laminated practice, is the earliest enlightenment derived from IBM SLC process, in its Japanese Yasu plant trial production began in 1989, the law is based on the traditional double panel, since the two outer panel first comprehensive quality such as Probmer before coating liquid photosensitive 52, after half a hardening and sensitive solution like make the mines with the next layer of shallow form "optical hole" (Photo - Via), then chemical comprehensive increase conductor of copper and copper plating layer, and after line imaging and etching, can get the new wire and with the underlying interconnection buried hole or blind hole.Such repeated layering will result in the number of layers needed.This method not only eliminates the expense of expensive mechanical drilling, but also reduces the hole size to less than 10mil.In the past five to six years, various kinds of multi-layer board technology that breaks the tradition and adopts successive layers have been promoted by American, American and European companies, making the Build Up Process famous and more than ten kinds of products have been listed.In addition to the above "photosensitive hole";After removing the copper layer at the hole location, different "hole forming" approaches such as hole biting, Laser Ablation, and Plasma Etching, etc. for organic sheet materials.Besides, the new Resin Coated "Resin Coated Copper Foil" (Resin Coated Copper Foil) can be used to make thinner, smaller and thinner multilayer board by Sequential Lamination.In the future, diversified personal electronic products will become the world of this kind of really thin and short multi-layer board.
Cermet USES ceramic powder mixed with metal powder, and the adhesive is added as a kind of coating, which can be printed on the circuit board (or inner layer) with thick film or thin film, as a cloth placement of "resistor" to replace the external resistor when assembled.
Co - Firing co-firing
The invention is a porcelain Hybrid PCB board (Hybrid) manufacturing process. The circuit of various precious metal Thick Film Paste is printed on the small board surface, and it is fired at high temperature.The various organic carriers in the thick film paste are burned, leaving the wires of the precious metal conductors for interconnection.
Crossover of Crossover, the three-dimensional crossing of two wires across the intersection of the slab surface, filling with insulating medium between the intersection drop.On the surface of green paint with single panel, carbon film jumper is added, or above the layup method, under the wiring is such "cross over".
Discreate scattered line Wiring Board, PCB, double track plate
Another term, multi-wiring Board, is a circular enameled wire attached and perforated on the Board surface.This kind of compound wire board has better performance in high frequency transmission line than the general PCB etched flat square wire.
DYCOstrate method of hole augmentation in plasma etching
Build up Process developed by Dyconex in Zurich, Switzerland.It is a patented process of etching the copper foil at each hole location on the board surface, which is then put into a closed vacuum environment and filled with CF4, N2 and O2 to ionize at high voltage to form highly active Plasma, which is used to etch the base material of perforation position, and the small conducting holes (below 10mil) appear. Its commercial process is called DYCOstrate.