Introduction of common standards in PCB

- Aug 18, 2018-

1) ipc-esd-2020: joint standard for development of electrostatic discharge control procedures.Includes the design, establishment, implementation and maintenance of the electrostatic discharge control program.According to the historical experience of some military and commercial organizations, it provides guidance for the treatment and protection of electrostatic discharge sensitive period.2) ipc-sa-61 A: cleaning manual for half water after welding.Includes all aspects of semi-water cleaning, including chemical, production residues, equipment, process, process control, and environmental and safety considerations.3) ipc-ac-62a: wash manual after welding.Describe the cost of manufacturing residues, type and nature of water cleaners, water cleaning processes, equipment and processes, quality control, environmental control and measurement of employee safety and cleanliness.4) ipc-drm-4 0E: table reference manual for assessment of through-hole welding points.Detailed descriptions of components, hole wall and welding surface coverage as required by the standards, in addition to computer-generated 3D graphics.It covers solder filling, contact Angle, soldering, vertical filling, solder pad cover and numerous solder joint defects.5) ipc-ta-722: welding technology assessment manual.Includes 45 articles on various aspects of welding technology, covering general welding, welding materials, manual welding, batch welding, wave welding, reflux welding, gas phase welding and infrared welding.6) ipc-7525: template design guide.Provides guidelines for the design and manufacture of solder paste and surface-mount binder coated templates I also discusses the design of templates for applying surface-mount technology, and introduces components with through-holes or flip chip.The technology includes overprinter, double printing and stage template design.7) IPC/EIA j-std-004: specification requirement 1 for flux includes appendix I.Technical indexes and classification of rosin, resins, etc., organic and inorganic flux classified according to the content of halides and activation degree of flux;It also includes the use of flux, substances containing flux, and low residual flux used in the no-rinse process.8)IPC/EIA j-std-005: specification requirements for solder paste 1 include appendix I.The characteristics and technical requirements of solder paste are listed, as well as the test methods and standards of metal content, as well as viscosity, sloughing, solder ball, viscosity and solder paste stain performance.9) IPC/EIA j-std-0 06A: specification requirements for electronic grade solder alloy, flux and non-flux solid solder.For electronic grade solder alloys, for stick, band, powder solder and non-flux solder, for electronic solder applications, for special electronic grade solder terminology naming, specification requirements and test methods.10) ipc-ca-821: general requirements for thermal conductive binders.This includes requirements and test methods for attaching components to a thermally conductive dielectric at the appropriate location.11) ipc-3406: guide for conductive surface coating binders.Guidance is provided in electronic manufacturing for the selection of an alternative conductive binder for solder.12) ipc-aj-820: assembly and welding manual.Includes descriptions of inspection techniques for assembly and welding, including terms and definitions;Standard reference and outline for the type of printed circuit board, components and pins, materials for welding points, components installation and design;Welding technology and packaging;Cleaning and mulching;Quality assurance and testing.13) ipc-7530: temperature curve guide for batch welding process (reflow soldering and wave soldering).Various testing methods, techniques and methods are used to obtain the temperature curve, which provides guidance for establishing the best graph.14) ipc-tr-460a: printed circuit board wave crest welding fault removal list.A list of recommended fixes for possible faults caused by wave soldering.15) the IPC/EIA/JEDEC J - STD - 003 - a.Testing the weldability of PCB.16) j-std-0 13: application of ball and foot lattice array encapsulation (SGA) and other high-density technologies.The specification requirements and interactions required to establish the PCB packaging process provide information for high-performance and high-pin number IC package interconnections, including design principles information, material selection, board manufacturing and assembly techniques, testing methods, and reliability expectations based on end-use environments.17) ipc-7095: complement to SGA device design and assembly process.Provide all kinds of useful operational information for people who are using SGA devices or considering switching to array encapsulation;Provide guidance on SGA testing and maintenance and provide reliable information on SGA field.18) ipc-m-i08: cleaning instruction manual.Includes the latest version of IPC cleaning guide to assist manufacturing engineers in determining product cleaning processes and troubleshooting.Ipc-ch-65-a: cleaning guide for PCB assembly #e#19) ipc-ch-65-a: cleaning guide for PCB assembly.Provides references to current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, and explains the relationships between various materials, processes, and contaminants in manufacturing and assembly operations.20) ipc-sc-60a: cleaning manual for solvents after welding.The use of solvent cleaning in automatic welding and manual welding is presented, and the properties of solvent, residues, process control and environmental issues are discussed.21) ipc-9201: surface insulation resistance manual.Includes terms, theory, test process and test means of surface insulation resistance (SIR), temperature, humidity (TH) test, failure mode and troubleshooting.22) ipc-drm-53: introduction to the reference manual of electronic assembly desktop.Diagrams and photographs illustrating through-hole mounting and surface mounting techniques.23) ipc-m-103: standard of surface mount assembly manual.This section includes all 21 IPC files related to surface mount.24) ipc-m-i04: printed circuit board assembly manual standard.Contains the 10 most widely used documents related to PCB assembly.