Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.
Multicore Solder Materials
For decades, Multicore® has been the brand assembly specialists trust for all of their soldering requirements. Through leading-edge development, backed by the expertise of the industry’s premiere chemists and engineering experts, Multicore solder materials continue to lead the way for next-generation manufacturing.
Always staying ahead of the curve and anticipating market change before it actually happens, Henkel began development of its line of Multicore lead-free products long before the industry at large was even talking about the implications of RoHS. This forward-thinking mindset is what has yielded the industry’s most reliable, capable and trusted brand in solder.
The Multicore portfolio includes market-leading lead-free solder pastes, tin-lead paste formulations for traditional and crossover manufacturing, flux solutions for dual wave and lead-free processes, cored solder wire, solid solder wire and a host of products for delicate hand soldering and re-work operations.
When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol® line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturiy
Electronics in automobiles have grown substantially in the last decade and are only expected to increase as cars become more intelligent, energy-efficient, safer and more comfortable. With more function comes the need for more advanced electronics, which require high-reliability materials that can cope with a variety of automotive applications. Henkel offers experience in multiple formulation techniques – for example, marrying adhesive performance with thermal control in hybrid materials – and is providing superior value to automotive manufacturers as they consider next-generation designs. From under-the-hood control to in-cabin comfort, entertainment and safety to exterior lighting, keyless entry and tire sensors, Henkel materials have automotive electronics manufacturers covered -- bumper to bumper.