FPC hole metallization and copper foil surface cleaning process

- Jul 26, 2018-

The hole metallization of flexible printing plate is basically the same as that of rigid printing plate.

In recent years, instead of chemical plating, direct plating technology is used to form carbon conductive layer.

The hole metallization of flexible printing plate is also introduced.

Due to its softness, flexible printing plate needs special fixed fixture, which can not only fix the flexible printing plate, but also must be stable in the plating solution, otherwise the copper plating thickness is not even, which is also an important reason for wire breaking and bridge connecting in the etching process.

To obtain a uniform copper plating layer, the flexible printing plate must be taut in the fixture, and the electrode position and shape must be worked on.

In the process of hole metallization outsourcing, it is necessary to avoid outsourcing to factories with no experience in the kongming of flexible printing plate as much as possible. If there is no special electroplating line for flexible printing plate, the toning quality cannot be guaranteed.

Copper foil surface cleaning -FPC manufacturing process

In order to improve the adhesion of anti-corrosion mask, the surface of copper foil should be cleaned before coating anti-corrosion mask.

Generally, there are chemical cleaning process and mechanical grinding process. For precision graphics manufacturing, most of the occasions are to combine two cleaning processes for surface treatment.

Mechanical grinding USES the method of brush polishing. Too hard brushing material will cause damage to the copper foil, too soft and insufficient grinding.

Usually with nylon brush, the length and hardness of the brush must be carefully studied.

Two brush rollers are used and placed on the top of the conveyor belt. The rotation direction is opposite to that of the belt. However, if the brush roll is under too much pressure, the base material will be stretched due to great tension, which is one of the important reasons for the size change.

If the surface of the copper foil is not clean, the adhesion with the anti-corrosion mask will be poor, which will reduce the qualified rate of the etching process.

Recently, due to the improvement of the quality of copper foil, the surface cleaning process can also be omitted in the case of single circuit.

However, the surface cleaning is an essential process for precision graphics below 1OO cape m.