Differences in electroplating water spatter plating and evaporation

- Aug 28, 2018-

Generally, electroplating can be divided into the following types:

1. Evaporation: surface adhesion; 

2. Sputtering: surface exchange; 

3. Water plating: molecular binding

Both evaporation and spatter are used to deposit various metal and non-metal films on the surface of the plastic parts by distillation or sputtering under vacuum conditions. In this way, a very thin surface coating can be obtained, and it has the outstanding advantages of fast adhesion.Vacuum evaporation method is a method of heating metal under high vacuum to melt and evaporate it, and forming metal film on sample surface after cooling. 

Would you like to know the difference in electrical conductivity between these different electroplating methods? 

Common electroplating, it is to point to water is plated, water is plated conductive, vacuum is plated now have discontinuous coating can do not conduct electricity surface adhesion and wear-resisting performance how?As electroplating is generally used as surface (exterior surface), spattering is mainly used for inner surface (anti-emi, and there are some small keys for surface treatment, such as some keys). Comparatively speaking, the thickness of water-plating film is about 0.01 to 0.02MM, while the thickness of vacuum spatter film is about 0.005MM. The abrasion resistance and adhesion of electroplating are relatively better. 

Vacuum sputtering

It mainly USES glow discharge to impact argon (Ar) ions on the surface of target, and the atoms of target are ejected and piled up on the surface of substrate to form a thin film.The properties and uniformity of the splash film are better than the evaporation film, but the coating speed is much slower than the evaporation film.Almost all the new spattering equipment USES strong magnets to spin electrons into spirals to accelerate the ionization of argon around the target, which increases the chance of collision between the target and argon ions and increases the spattering rate.General metal deposition by dc sputtering, mostly without conductive ceramics material is used communication RF sputtering, the basic principle is used in the vacuum glow discharge (glow discharge) to argon (Ar) ion impact surface of target (target), plasma of cation is speeding toward as a negative electrode surface coating material, the impact will make material fly out of target material and form a thin film deposited on the substrate.In general, there are several features of film coating using spattering process:

(1) metal, alloy or insulation can be made into thin film materials. 

(2) under proper setting conditions, multiple and complex target materials can be made into a film of the same composition. 

(3) the mixture or compound of target materials and gas molecules can be made by adding oxygen or other active gases into the discharge atmosphere. 

(4) the input current and sputtering time of the target can be controlled and the high-precision film thickness can be easily obtained. 

(5) compared with other processes, it is more advantageous to produce uniform films with large area. 

(6) sputtering particles are almost free from the influence of gravity, and the position of target and substrate can be arranged freely. 

(7) the adhesion strength of substrate and film is more than 10 times that of conventional evaporation coating. Moreover, due to the high energy of sputtering particles, hard and dense films will continue to diffuse on the surface of the film forming surface. At the same time, such high energy enables the substrate to get crystalline film as long as the temperature is low. 

(8) the density of nucleation at the initial stage of film formation is high, and extremely thin continuous film under 10nm can be produced. 

(9) long life of target material, long time automatic continuous production. 

(10) the target material can be made into various shapes to make better control system and the most efficient production with the special design of the machine.The coating thickness of water plating is thicker than vacuum plating, and the wear resistance is better than true plating. 

To sum up, the differences are as follows:

1. Vacuum plating process is environmentally friendly, and water plating has hidden dangers. 

2. Vacuum plating process is similar to baking process, and water plating is different. 

3. The adhesive force of vacuum plating is higher than that of water plating, so UV should be added.