degumming

- Aug 18, 2018-

degumming

J-kem International offers the highest quality universal slag removal process.

According to different Tg values can achieve the best effect, also suitable for flexible printed circuit board technology.

Bulk:

The formula is unique and high Tg material has excellent swelling effect.

Especially suitable for SBU process.

In addition to the glue residue:

• perfect microcoarsening structure.

• work in a wide temperature range and get the best results according to different Tg values.

• the best cu-cu binding force.

Neutral:

• no etching of the three links.

• remove all residues from copper surfaces.

Technical process of removing glue slag

 

steps

The product code

process

time

The temperature

1

J - 7100 KEM

bulk

5 min

60-65 DHS C

2

 

Hot water washing

60 SEC

40-50 DHS C

3

 

Water washing

2 min

RT

4

J - 7110 KEM

In addition to the glue residue

10 min

75 DHS C

5

 

Water washing

2 min

RT

6

 

Water washing

1 min

RT

7

J - 7120 KEM

neutralization

2 min

30 ° c.

8

 

Water washing

2 min

RT

9

 

Water washing

1 min

RT

10

 

Dry or PTH line

 

 

 

 

 

J-kem 7100 bentonite

 

The bentonite 7100 contains no plasma, trivalent chromium and sulfuric acid. It is the first step in the three processes of PCB pretreatment.Under the same working fluid condition, the bentonite 7100 can be successfully reetched on the bifunctional or four-functional epoxy resin.

The bulk 7100 contains two components: the bulk 7100A and the bulk 7100B.

 

Process conditions

 

The temperature

55-65 ℃ (best temperature 60 ℃)

time

5-10 minutes

stir

It is very important

Production rate of plating solution

18 m2 / L

* the time and temperature must be adjusted separately when processing special materials (it can be raised appropriately).

 

Prepare 100L cylinder opening liquid

 

Tank solution should be prepared according to the following steps:

1.Deionized water

60 L

2.Raising agent 7100 a

20 L

3.Raising agent 7100 b

20 L

4.Heated to

60 ℃

5.The solution may not be used until the turbidity in the solution has disappeared.

 

Bath maintenance

 

In order to make the plating solution stable and prolong its life, the plating solution should be supplemented by the analysis procedure provided by the company.

 

 

 

J-kem 7110 degumming slag agent

 

The degumming agent 7110 is the second step in the three process of cleaning the surface of the multilayer circuit board.

Through the swelling agent j-kem 7100, the insulation surface becomes slightly rough structure through further treatment with the degumming slag agent 7110.The most remarkable feature of this process is its wide temperature range and simple operation.

The surface degumming slag agent contains three components: degumming slag agent 7110 A, degumming slag agent 7110 B and degumming slag agent 7110 C.

 

Process conditions

 

 

Surface decontamination

pitting

The temperature

66-74 ℃

79-88 ℃

Immersion time

10-20 min *

15 to 30 min

(depending on the substrate and the degree to which the requirements are met)

Immersion time for standard epoxy resins

10-15 min

20 min

Production rate of plating solution

18 m2 / L

* the time and temperature must be adjusted separately when processing special materials (it can be raised appropriately).

 

Prepare 100L cylinder opening liquid

 

Under stirring conditions, each component is added in the following order:

 

Surface decontamination

pitting

1.Deionized water

751

751

2.Degumming agent 7110 B

151

151

3.Degumming slag 7110 A

6 kg

7-8 kg

4.7110 C

650 g

650 g

5.Add deionized water to the total amount and warm to the operating temperature.

 

Bath maintenance

 

In order to keep the plating solution stable and prolong its life, the plating solution 7110 should be analyzed and maintained regularly according to the analysis procedure provided by our company.

To achieve optimum conditions, the plating solution should be analyzed daily and adjusted before production.

 

 

J-kem 7120 neutralizer

 

Neutralizer 7120 is a stable hydrogen peroxide/sulfuric acid system used for multilayer printed circuit board after gluing residues on the surface.The solution can neutralize and dissolve the manganese oxides on the surface of the circuit board.The neutralizer 7120 can also produce a microetched copper surface, which enables copper to have excellent adhesion.

 

Process conditions

 

 

The scope of

The best

The temperature

20 to 25 ℃

22 ℃

Immersion time

1-3 min

2 min

Production rate of plating solution

When the copper concentration in the working fluid reaches 40 g/L, the neutralizer 7120 working fluid must be stopped and a new groove should be opened.

 

Prepare 100L cylinder opening liquid

 

1.Deionized water

80 L

2.Sulfuric acid, 96%

10 L

3.Hydrogen peroxide

5 L

4.Neutralizing agent 7120

5 L

Prepare the opening liquid

 

1.Before opening the new tank of the neutralizer 7120, make sure the old tank is completely clean;

2.Add approximately 70% deionized water of the total preparation amount of working liquid into the plating bath;

3.Add neutralizer 7120 to the tank according to the required amount, and mix well.

4.Carefully and slowly add the required amount of sulfuric acid to the tank and mix well.(note: 96% sulfuric acid is a highly corrosive liquid.)

5.The solution can be cooled to the working temperature range;

6.Carefully and slowly add the required amount of hydrogen peroxide to the tank;(note: 35% hydrogen peroxide is a strongly corrosive liquid.)

7.Ensure that the solution temperature is within the temperature range of the process conditions;

8.The working fluid is prepared and ready for use.

Plating solution maintenance

It is recommended to control the concentration of hydrogen peroxide and sulfuric acid in the range of 70%-100% of the initial concentration.Follow the analysis steps to control the working fluid.The supplement of 7120 must refer to the amount of hydrogen peroxide.