Basic introduction of SMT patch processing

- Sep 01, 2018-

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Basic introduction of SMT patch processing

Features of serismt

High assembly density, small size and light weight of electronic products, the volume and weight of SMT components is only about 1/10 of that of traditional cartridge components. Generally, after adopting SMT, the volume of electronic products is reduced by 40%~60% and the weight is reduced by 60%~80%.

High reliability and strong vibration resistance.Low defect rate of solder joint.

High frequency characteristic is good.Reduced electromagnetic and radio frequency interference.

Easy to realize automation and improve production efficiency.Reduce the cost by 30%~50%.Save materials, energy, equipment, manpower, time, etc.

  

Why did you use surface mount technology (SMT)? 

Electronic products pursue miniaturization, the previous use of the plug - in components has been unable to shrink

Electronic products have more complete functions. The integrated circuit (IC) adopted has no perforated components, especially the large scale and high integrated IC

Mass production, production automation, the factory to low cost high production, produce quality products to meet customer demand and strengthen market competitiveness

Development of electronic components, development of integrated circuits (IC), multiple applications of semiconductor materials

Electronic science and technology revolution is imperative, pursue international trend