Rigid PCB up to 30 layers
Flexible PCB up to 6 layers
Rigid flex PCB up to 20 layers
Metal based PCB up to 8 layers
Material used: FR4, high TG FR4, halogen free FR4, high frequency, ceramic, aluminum or copper based, polyimide, PTFE hybrid
Surface finish: HAL, lead free HAL, immersion gold, silver, tin, OSP, hard gold plating, ENEPIG, carbon ink, blue mask
DHI technology: 1+n+1,1+1+n+1+1,2+n+2,3+n+3, stacked vias available
Other special technology: conductively (or non-conductively) via filling, edge plating, back drill, heavy copper (up to 14oz), Via in PAD filling, extreme large or thick PCB, microwave & RF circuit boards
This is a type of RO4003C and FR-4 mixed PCB for the application of Balanced Amplifier. It's a
4 layer board at 1.6mm thick. The base laminate is from Rogers Corp. and ITEQ. Solder mask
and silkscreen from Nanya and Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerb
-er data. Each 10 boards or panels are packed separately.
· PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
· PCBA: PCB information, BOM, (Testing documents...)
· Gerber file: CAM350 RS274X
· PCB file: Protel 99SE, P-CAD 2001 PCB
· BOM: Excel (PDF,word,txt)
Your files are held in complete safety and security. We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.
We are able to handle Small as well as large volume production with flexibility.
The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.