6 Layer High Frequency Material Pcb Board

6 Layer High Frequency Material Pcb Board

Model NO.: 6 Layer high frequency material pcb board Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Organic Resin Trademark: FCF Transport Package: DHL Specification: 0.8-2.0mm, 2-8 layrs Origin: China

Product Details

6_layer_high_frequency_material_hdi_pcb_blue_solder_mask_with_bga.jpg

Model NO.: 6 Layer high frequency material pcb board

Processing Technology: Electrolytic Foil

Base Material: Copper

Insulation Materials: Organic Resin

Trademark: FCF

Transport Package: DHL

Specification: 0.8-2.0mm, 2-8 layrs

Origin: China


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