3-8 Layer Gold Finger Multi-Layer Flex PCB Design High Frequency Pcb Aspocomp Materials Board

3-8 Layer Gold Finger Multi-Layer Flex PCB Design High Frequency Pcb Aspocomp Materials Board

Dielectric: Copper Foil Application: Consumer Electronics Mechanical Rigid: Fexible Base Material: Copper Brand: Cmute Copper Thickness: 0.5 Oz, 1oz, 2oz Cover Film: Ployester Specification: customiz Type: Flexible Circuit Board Material: Paper Phenolic Copper Foil Substrate Flame Retardant Properties: V1 Processing Technology: Electrolytic Foil Insulation Materials: Polymide Pitch: 0.5mm, 1mm, 1.25mm Stiffener: Polymide Trademark: Cmute Origin: Shenzhen, China

Product Details

  • Model NO.: FD-2563

  • Dielectric: Copper Foil

  • Application: Consumer Electronics

  • Mechanical Rigid: Fexible

  • Base Material: Copper

  • Brand: Cmute

  • Copper Thickness: 0.5 Oz, 1oz, 2oz

  • Cover Film: Ployester

  • Specification: customiz

  • Type: Flexible Circuit Board

  • Material: Paper Phenolic Copper Foil Substrate

  • Flame Retardant Properties: V1

  • Processing Technology: Electrolytic Foil

  • Insulation Materials: Polymide

  • Pitch: 0.5mm, 1mm, 1.25mm

  • Stiffener: Polymide

  • Trademark: Cmute

  • Origin: Shenzhen, China



Layers Qty1 - 6 layersnished FPC SizeMin.:4x4mm    Max.:250x1200mmFPC Board Thickness:0.08-0.12mm for single layer, 0.12-0.22mm for double layerStiffener Material ChoicePI.PET,FR4-PIPitch of the Pin0.3mm, 0.5mm,0.8mm,1.0mm, 1.25mm,2.54mmFinished Board Thickness Tolerance±0.03mmFinished hole diameter(Min.)0.15mmFinished hole diameter(Max)0.6mmNPTH Hole diameter tolerance±0.025mmPTH hole diameter tolerance±0.050mmCopper foil thickness18um,35um,70um/Circuit width/spacing(Min.)≥0.065mm(1/2oz)≥0.05mm(1/3oz)Surface Finished typeOSP. Gold plating, Immersion Gold, Tin plating(lead free)etcGold Flash Ni/Au thicknessNi:2.54-9um  Au:0.025-0.5umImmersion Tin thickness0.7-1.2umTin plating thickness3-15umDrill hole position tolerance±0.05mmPunching dimension tolerance±0.05mmCertificateROHS,UL,ISO9001 etc FPC Manufacturing Capability                            Technical Performance Data


Product category Flexible or combined with Rigid PCB board
Monthly output 5000 square meters.
MaterialPolymide, Polyster, PET,PT,Rolling,Electrolysis
File formatCAD file(POWERPCB,PROTEL,PADS2000,AUTOCAD,ORCAD, Gerber file
Solder resist (solder mask)Laminated cover film,Liquid photosensitive prevent weld ink,PI oil film
Surface treatment Hot Air Solder Leveling,Tinning ,Sink tin ,gold-plating ,Chemistry sink gold ,Anti-oxidation ,Sink copper ,Tin copper
Finished Thickness0.068-0.6mm
Circuit Layers  Single-sided/multi-layer(4-2 Layer)
Max thin wire/spacing2-3mil
Min Hole Diameter0.2mm
  Maximum thickness/aperture ratio≤5Max Outline
Max Outline500×350mm
Profiling Process0.1mm CNC punching accuracy 0.1 mm edge
Acceptance StandardGuest standard ,IPC, GB standard (China)
Sample Leadtime3 to 5 Days