Single Layer Fr4 PCB With High Resistance Carbon Ink

Single Layer Fr4 PCB With High Resistance Carbon Ink

Model NO.: WBPN2256BO Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Brand: Xzg Size: 268mm*78.6mm Min. Hole Size: 0.7mm Min Line Width and Distance: 7/7mil Solder Mask: Green Silkscreen: White Trademark: XZG Transport Package: Vaccume Package...

Product Details

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Model NO.: WBPN2256BO

Processing Technology: Electrolytic Foil

Base Material: Copper

Insulation Materials: Epoxy Resin

Brand: Xzg

Size: 268mm*78.6mm

Min. Hole Size: 0.7mm

Min Line Width and Distance: 7/7mil

Solder Mask: Green

Silkscreen: White

Trademark: XZG

Transport Package: Vaccume Package

Specification: UL/GSG/RoHS

Origin: China

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