Multilayer PCB Immersion with Gold-Plated Finish

Multilayer PCB Immersion with Gold-Plated Finish

Model NO.: BP006 Processing Technology: Delay Pressure Foil Base Material: Copper Insulation Materials: Metal Composite Materials Brand: KT Trademark: Brainpower Transport Package: Vacuum Dust Bag+Bubble Bag Origin: China

Product Details

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Model NO.: BP006
Processing Technology: Delay Pressure Foil
Base Material: Copper
Insulation Materials: Metal Composite Materials
Brand: KT
Trademark: Brainpower
Transport Package: Vacuum Dust Bag+Bubble Bag

Origin: China Found-PCB-Manufactory


ItemCapabilities
Number of layersDouble sided - 12 layers
Major materialFR-4, CEM-3, Hologen free, high Tg
(Other material as request)
Min board thicknessDouble side0.2mm (7.8mil)
4 Layers0.4mm (16 mil)
6 Layers0.6mm (24 mil)
8 Layers1.0mm (40 mil)
10 Layers1.2mm (48 mil)
12 Layers1.5mm (59 mil)
Max board thickness3.2mm (125 mil)
Surface finish-Flash gold plating
-Immersion gold (max 0.5μm)
-Thick gold-plating (max 1.5μm)
-HASL (Tin / Lead)
-Entek coating (OSP) - Gold finger
-HASL - lead-free
-Immersion Tin





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