Multilayer PCB, Fr4, Blind Hole

Multilayer PCB, Fr4, Blind Hole

Model NO.: Multilayer PCB Dielectric: FR-4 Application: Communication Mechanical Rigid: Rigid Base Material: Copper Brand: FD Transport Package: CTN Origin: China Type: Rigid Circuit Board Material: Paper Phenolic Copper Foil Substrate Flame Retardant Properties: V0 Processing Technology: OSP Insulation Materials: Organic Resin Trademark: N/A Specification: 30*30 HS Code: 8534009000

Product Details

  • Model NO.: Multilayer PCB

  • Dielectric: FR-4

  • Application: Communication

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: FD

  • Transport Package: CTN

  • Origin: China

  • Type: Rigid Circuit Board

  • Material: Paper Phenolic Copper Foil Substrate

  • Flame Retardant Properties: V0

  • Processing Technology: OSP

  • Insulation Materials: Organic Resin

  • Trademark: N/A

  • Specification: 30*30

  • HS Code: 8534009000

 Our main products range form copper or aluminum base substrates to laminates with all kinds of surface treatment, from single-sided single-layer to multi-sided multi-layers. Whatever you required, we'll achieve your satisfication. We can offer you the best PCB and PCB assembly services at low-to-large volume, verified by ISO09001,including FR-4,flexible,rigid-flex,carbon ink, aluminum types. We are capable of controlled impedance, heavy copper, HDI, blind & buried vias and small chips down to 0201 and 0.25 mm BGA.


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