Multilayer PCB, Fr4, Blind Hole

Multilayer PCB, Fr4, Blind Hole

Model NO.: Multilayer PCB Dielectric: FR-4 Application: Communication Mechanical Rigid: Rigid Base Material: Copper Brand: FD Transport Package: CTN Origin: China Type: Rigid Circuit Board Material: Paper Phenolic Copper Foil Substrate Flame Retardant Properties: V0 Processing Technology: OSP Insulation Materials: Organic Resin Trademark: N/A Specification: 30*30 HS Code: 8534009000

Product Details

  • Model NO.: Multilayer PCB

  • Dielectric: FR-4

  • Application: Communication

  • Mechanical Rigid: Rigid

  • Base Material: Copper

  • Brand: FD

  • Transport Package: CTN

  • Origin: China

  • Type: Rigid Circuit Board

  • Material: Paper Phenolic Copper Foil Substrate

  • Flame Retardant Properties: V0

  • Processing Technology: OSP

  • Insulation Materials: Organic Resin

  • Trademark: N/A

  • Specification: 30*30

  • HS Code: 8534009000

 Our main products range form copper or aluminum base substrates to laminates with all kinds of surface treatment, from single-sided single-layer to multi-sided multi-layers. Whatever you required, we'll achieve your satisfication. We can offer you the best PCB and PCB assembly services at low-to-large volume, verified by ISO09001,including FR-4,flexible,rigid-flex,carbon ink, aluminum types. We are capable of controlled impedance, heavy copper, HDI, blind & buried vias and small chips down to 0201 and 0.25 mm BGA.


Our main products range form copper or aluminum base substrates to laminates with all kinds of surface treatment, from single-sided single-layer to multi-sided multi-layers. Whatever you required, we'll achieve your satisfication. We can offer you the best PCB and PCB assembly services at low-to-large volume, verified by ISO09001,including FR-4,flexible,rigid-flex,carbon ink, aluminum types. We are capable of controlled impedance, heavy copper, HDI, blind & buried vias and small chips down to 0201 and 0.25 mm BGA.FOB Price: US $ 0.1-10 / Piece Min. Order: 500 Pieces Type: Rigid Circuit BoardDielectric: FR-4Material: Paper Phenolic Copper Foil SubstrateApplication: CommunicationFlame Retardant Properties: V0Mechanical Rigid: Rigid

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