Power modules Heavy copper
Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3
Copper Thickness:0.3oz-6oz
Board Thickness:0.2mm-6mm
Min. Hole Size:0.1mm
Min. Line Width:0.15mm
Min. Line Spacing:0.15mm
Surface Finishing:HASL,ENIG,OSP
Layer No.:1-32 Layers
PCB Test:Flying probe and AOI (Default)/Fixture Test
Base, Cover film, Stiffeners thickness::0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch:1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly Method:SMT, Through-hole, Mixed, BGA
PCB Assembly Test:Visual Inspection (default), AOI, FCT, X-RAY
Hi-TG FR4 Material:Tg-130 Tg-140 Tg-160 Tg-170
Electrical Testing:Net List Test, Flying Probe Test
