Power Modules Heavy Copper

Power Modules Heavy Copper

Power modules Heavy copper Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3 Copper Thickness:0.3oz-6oz Board Thickness:0.2mm-6mm Min. Hole Size:0.1mm Min. Line Width:0.15mm Min. Line Spacing:0.15mm Surface Finishing:HASL,ENIG,OSP Layer No.:1-32 Layers PCB Test:Flying probe and AOI (Default)/Fixture Test...

Product Details

Power modules Heavy copper


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Base Material:FR-4,Hi-TG FR4,CEM-1,CEM-3

Copper Thickness:0.3oz-6oz

Board Thickness:0.2mm-6mm

Min. Hole Size:0.1mm

Min. Line Width:0.15mm

Min. Line Spacing:0.15mm

Surface Finishing:HASL,ENIG,OSP

Layer No.:1-32 Layers

PCB Test:Flying probe and AOI (Default)/Fixture Test

Base, Cover film, Stiffeners thickness::0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um

BGA Ball Pitch:1mm ~ 3mm(4mil ~ 12mil)

PCB Assembly Method:SMT, Through-hole, Mixed, BGA

PCB Assembly Test:Visual Inspection (default), AOI, FCT, X-RAY

Hi-TG FR4 Material:Tg-130 Tg-140 Tg-160 Tg-170

Electrical Testing:Net List Test, Flying Probe Test

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