Multilayer PCB Board CNC PCBA Design

Multilayer PCB Board CNC PCBA Design

Model NO.: RM0012L001 Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Organic Resin Brand: Lefang Base Material/ Dielectric: Sy, Kb, Iteq, Isola, Rogers Layer: 12L S urface Treatment: Immersion Gold Solder Mask: Yellow Board Thickness: 2.0mm Min. Aperture:...

Product Details

Model NO.: RM0012L001

Processing Technology: Electrolytic Foil

Base Material: Copper

Insulation Materials: Organic Resin

Brand: Lefang

Base Material/ Dielectric: Sy, Kb, Iteq, Isola, Rogers

Layer: 12L

Surface Treatment: Immersion Gold

Solder Mask: Yellow

Board Thickness: 2.0mm

Min. Aperture: 0.2mm

Line Width/Spacing: 4/4mil

Trademark: LEFANG

Transport Package: Inner; Vacuum Packing; Dry Packing out Packing

Specification: 310.60mm*288.20mm

Origin: Shenzhen, China

HS Code: 8534001000

Material

FR-4

Remarks

High Tg CCL is Available(Tg>=170ºC)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)

Shape

Routing

Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Copper Thickness

1/2 oz min; 12oz max

Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Min spacing between hole edge

0.25mm(10mil)

Min spacing between board outline

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

 


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