Multilayer Hard Gold 3OZ PCB

Multilayer Hard Gold 3OZ PCB

Multilayer Hard Gold 3OZ PCB

Product Details

General profile:
Multilayer PCB represents one of the most complicated products in the PCB industry. A breakdown of a multilayer PCB shows that it consists of three basic elements: thin rigid laminates, prepreg sheet for bonding the laminates and copper foils.

The process of multilayer PCB:
1. In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.

2. Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.

3. After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.

Thin laminate(base material FR-4)
ShengyiS11410.05-3.2 mm17-105 µm≥130ºC≤5.4
ShengyiS11700.05-3.2 mm17-105 µm≥170ºC≤5.4
ITEQIT-1400.05-1.5 mm17-175 µm≥135ºC<5.4
ITEQIT-1800.05-1.5 mm17-175 µm≥170ºC<5.4
ITEQIT-180A0.05-1.5 mm17-175 µm≥170ºC<5.4
Comparison of different Prepreg
Type of PrepregFinished thicknessResin Content

7628H (7630)0.2138.450

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