The process of multilayer PCB:
1. In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.
2. Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.
3. After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.
Thin laminate(base material FR-4)
|Shengyi||S1141||0.05-3.2 mm||17-105 µm||≥130ºC||≤5.4|
|Shengyi||S1170||0.05-3.2 mm||17-105 µm||≥170ºC||≤5.4|
|ITEQ||IT-140||0.05-1.5 mm||17-175 µm||≥135ºC||<5.4|
|ITEQ||IT-180||0.05-1.5 mm||17-175 µm||≥170ºC||<5.4|
|ITEQ||IT-180A||0.05-1.5 mm||17-175 µm||≥170ºC||<5.4|
Comparison of different Prepreg
|Type of Prepreg||Finished thickness||Resin Content|