Specification:
Material:FR4 kb
value:tg135
board thickness:1.6mm
copper thickness:2/2oz
Surface treatment:pb free
Our main process capability:
| Items | Standard | Advanced | |
| Layer Count | 1-20 | 1-24 | |
| Board Thickness | 0.2-5.0mm | 0.2-7.0mm | |
| Max. Panel Size | 520X660mm | 680X1200mm | |
| Min. Mechnical Drill | 0.2mm | 0.15mm | |
| Min. Line width&space | 0.1/0.1mm | 0.076/0.076mm | |
| Max. Copper Thickness | 6 oz | 8oz | |
| Max. Aspect Ratio | 8:1 | 10:1 | |
| Solder Mask Color | Green,Black,White,Blue,Red,Matt Green, Matt Black | ||
| Silkscreen Color | White,Black,Yellow,Grey,Orange | ||
| Base Material | CEM1,CEM3,FR4,IMS,aluminum | ||
| Surface Treatment | HASL(Lead Free),OSP,ENIG, ENEPIG,Immersion Silver,Immersion Tin, Hard Gold Plating,Tin Plating, Silver Plating | ||
