Heavy Copper ITEQ KB PCB

Heavy Copper ITEQ KB PCB

Heavy Copper ITEQ KB PCB

Product Details

Heavy Copper ITEQ KB PCB



Port:

Shenzhen, China

Production Capacity:

60000 Square Per Month

Payment Terms:

L/C, T/T, D/P, Western Union, Paypal, Money Gram


Structure:

Multilayer Rigid PCB

Dielectric:

Material

Material:

Polyester Glass Fiber Mat Laminate

Application:

Consumer Electronics

Flame Retardant Properties:

V0

Processing Technology:

Electrolytic Foil



Our One-Stop Service for PCB & PCB Assembly manufacturing:
1. Quick Quotation - Competitive factory direct price is always offered
2. Free Sample - Sample for free before mass production
3. Quality Control - Complete test procedure is necessary
4. On Time Delivery - Customize the logistics plan according to customer's requirement
5. After-sale Service - Reply to the claim within 24 hours to make sure our customer's manufacturing


How to get quick quotation?
Step 1. Please send us Gerber file with these format: .CAD/ .Gerber/ .PCB / .DXP/ .P-CAD, etc;
Step 2. Also please provide us the below details for quick quotation:
a) Board material: Fr-4/ CEM-1/ CEM-3/ SY/ KB/ Rogers/High Tg/ copper based/ aluminum based, etc;
b) Board thickness: 0.1-6.0mm;
c) Copper thickness: 0.05 Oz-8Oz (17um-288um)
d) Surface Treatment: OSP/ ENIG/ HASL/ Lead Free HASL/ Immersion Tin/ Immersion Sin
e) Color of solder mask and silk print: Green/ red/ blue/ black/ white/ yellow
f) Board size and quantity
g) BOM(Bill of Materials) list if PCB Assembly
P.S. If you don't have Gerber file, please provide us the imfomation as step 2 or send your PCB Board to us for clone.



Product Description:

ItemDetails
Max layer count20L
Max board thickness6.0mm
Max aspect ratio10:1
Max copper thickness6OZ
Max dimension600x700mm
Min thickness of 4 layers PCB0.4mm
Min hole/ pad0.15/0.35mm
Hole location accuracy+/-0.05mm
PTH hole tolerance+/-0.05mm
Min line width and line space0.065/0.065mm
Surface treatmentHASL/HASL lead free, OSP, Immersion gold/silver/tin, gold plating (hard gold and soft gold), silver plating, tin plating, platinum plating, carbon ink, and ENEPIG(electroless nickel - electroless palladium - immersion gold)



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