Gold Finger Immersion Silver PCB

Gold Finger Immersion Silver PCB

Gold Finger Immersion Silver PCB

Product Details

Gold Finger Immersion Silver PCB



Port:

Shenzhen, China

Production Capacity:

90000sqmeters/Month

Payment Terms:

L/C, T/T, D/P, Western Union, Paypal, Money Gram


Type:

Rigid Circuit Board

Dielectric:

Teflon

Material:

PTFE

Flame Retardant Properties:

V0

Mechanical Rigid:

Rigid

Processing Technology:

Electrolytic Foil



Technology capability


Items
Single/Double-sided Board/Multilayer Board/FPC(1-24Layer)
Base MaterialsFR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo
Finish copper thicknessOuter 6 OZ,Inner 4 OZ
Surface finishENIG, ImAg, ImSn, OSP, HASL,Plating gold
Finished Board SizeMax Double-sided Board640mm χ 1100mm
Max Multilayer Board640mm χ 1100mm
Finished Board Hole Size (PTH Hole)Min Finished Board Hole Size0.15mm
Conductor Width and SpacingMin Conductor Width0.01mm
Min Conductor Spacing0.01mm
Thickness of Plating and Coating LayerPTH Wall Copper Thickness>0.02mm
Tin Solder Thickness ( Hot Air Leveling )>0.02mm
Nickl/Gold ThicknessFor customer special need
Nickl Plating Layer>2um
Gold Plating Layer>0.3um
Bare Board TestSingle Side TestMax Test Point20480
Max Board Test Size400mm χ 300mm
Double Side TestMax Test Point40960(General Use)
4096(Special Use)
Max Board Test Size406mm χ 325mm
320mm χ 400mm
Min Test pitch of SMT0.5mm
Test Voltage10-250V



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