Fr4 Rigid Automotive Circuit Board

Fr4 Rigid Automotive Circuit Board

Model NO.: RM0004L054 Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Organic Resin Brand: Lefang Base Material/ Dielectric: Sy, Kb, Iteq, Isola, Rogers Layer: 4layers S urface Treatment: Immersion Gold Solder Mask: Green Copper Thickness: 1oz Board Thickness:...

Product Details

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Model NO.: RM0004L054
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Brand: Lefang
Base Material/ Dielectric: Sy, Kb, Iteq, Isola, Rogers
Layer: 4layers
Surface Treatment: Immersion Gold
Solder Mask: black
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Aperture: 0.2mm
Min Line Width/Space: 0.1mm/0.1mm
Trademark: LEFANG
Transport Package: Inner; Vacuum Packing; Dry Packing out Packing
Specification: 428.4*147.68mm
Origin: Shenzhen, China
HS Code: 8534001000


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