Fr-4 PCB Blind Buried Via

Fr-4 PCB Blind Buried Via

This manufacturability guide provides an overview of various areas that printed circuit board designer may take into consideration on the fabrication possibility, manufacturing cost and reliability of their products.

Product Details

General profile

The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone,PDA board etc.

Advantages
A) Reduce the probability of signal interference;
B) Keep the continuity of the characteristic impedance of the transmission line;
C) Save wiring space, suitable for high density and high speed circuit board design;

Application
Mobile phone, PDA boards, telecommunications, complext modules.10-19-01

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