Item
| Capabilities | ||
| Number of Layers | Double Side | |
| Material | FR-4,CEM-3,HighTg, Aluminum, Halogen Free | |
| PCB Thickness | Min.thickness | 0.2mm(8mil) |
| Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
| Immersion Gold(Silver) | ||
| HAL Lead Free | ||
| Hot Air Solder Leveling(HASL) | ||
| Entek Coating (OSP) | ||
| Solder Mask | Green | |
