Item
Capabilities | ||
Number of Layers | Double Side | |
Material | FR-4,CEM-3,HighTg, Aluminum, Halogen Free | |
PCB Thickness | Min.thickness | 0.2mm(8mil) |
Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
Immersion Gold(Silver) | ||
HAL Lead Free | ||
Hot Air Solder Leveling(HASL) | ||
Entek Coating (OSP) | ||
Solder Mask | Green |