Edge Plating ITEQ KB PCB
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Double-Sided Rigid PCB
Polyester Glass Fiber Mat Laminate
Flame Retardant Properties:
|Surface Finishing||Lead Free HAL|
|Min Line Width/Space||4/4 mil|
|Min Hole Size||0.2mm|
1) Through hole,BGA package on multilayer PCBs -->via on ball -->resin via plug -->ground surface -->copper electroplated on plugged via.
2) Blind via, a technique similar to a through hole, with a controlled depth of 0.075mm for the blind hole.
3) HDI multi-step stacking hole technology.The interconnected processing technology is very complex. Multiple hole filling and multiple copper pressing are used to complete the manufacturing process.Such structure in medical, communication products are widely recommended for application.