1.Specification:
| Layer | 4 |
| Material | fr4 tg150 |
| Board Thickness | 1.2mm |
| Copper Thickness | 2oz |
| Soldermask | blue |
| Silkscreen | white |
| Surface Finishing | Lead Free Hal |
| Min Line Width/Space | 0.3/0.4 mm |
| Min Hole Size | 0.4mm |
2.Capability:
| Layer Count | 1 to 22 layer |
| Material Type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers.etc. |
| Board Thickness | 0.21mm to 7.0mm |
| Copper Thickness | 0.5 oz to 7.0 oz |
| Min. Line Width&Space | 3/3 mil |
| Min. Mechnical Hole | 0.15mm(0.8mm for Alu PCB) |
| Min.Solder Mask Dam | 0.075mm |
| Max.Aspect Ratio | 10:1 |
| PTH Size Tolerance | +/- 0.05mm |
| Impedance Control Tolerance | +/- 8% |
| Routing Tolerance | +/- 0.1mm |
| Electric Strength | >103KV/mm |
| Current Breakdown | 10A |
| Solder Mask Abrasion | >6H |
| Solder Mask Color | Green/Black/White/Red/ Blue/Matt Blue/Matt Black |
| Silkscreen Color | Yellow/Black/White/ Orange/Grey |
| Surface Finishing | HASL / HASL lead free,OSP, Tin Plating, Silver Plating Immersion Silver/Tin, ENIG, Hard Gold plating |
| PCB Packing | - Inner Packing: Vacuum packing / plastic bag - Outer packing: Standard carton packing |
