Blind Buried Via Immersion Gold PCB

Blind Buried Via Immersion Gold PCB

Blind Buried Via Immersion Gold PCB

Product Details

Blind Buried Via Immersion Gold PCB



Min. Order:

1 Piece

Port:

Shenzhen, China

Production Capacity:

20000 Square Meter/Mon

Payment Terms:

L/C, T/T, Western Union, Paypal


Structure:

8 Layer

Dielectric:

FR-4

Material:

Fr4

Application:

Aerospace

Flame Retardant Properties:

HB

Processing Technology:

Electrolytic Foi



Blind Buried Via Immersion Gold PCB

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of
Monitoring Systems. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo)
and immersion gold on pads. The base material is from ITEQ supplying 44 up PCBs per panel.
They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 2 panels are packed
for shipment.



Parameter and data sheet

1Layer1-20 layers
2MaterialFR-4(High TG),CEM-1,Aluminum base,FR-1,CEM-3,Rogers,TEFLON
3Board thickness0.2mm-6mm
4Max.finished board size1200*600mm
5Min.drilled hole size0.1mm
6Min.line width0.075mm(3mil)
7Min.line spacing0.075mm(3mil)
8Surface finish/treatmentHASL/HASL lead free,Immersion Gold/Tin/Silver,OSP,gold plating/finger,Carbon ink,Peelable mask
9Copper thickness18um-280um(0.5OZ-8OZ)
10Solder mask colorgreen/black/white/red/blue/yellow
11Outline Tolerance±0.13mm
12Impedance control Tolerance±10%
13Hole tolerancePTH:±0.075mm,NPTH:±0.05mm
14CertificateUL,ISO9001,ISO14001,SGS
15Profiling punchingRouting,V-CUT,Beveling
16Production capability60,000 s.q.m/month




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