Blind Buried Via CEM3 PCB

Blind Buried Via CEM3 PCB

Blind Buried Via CEM3 PCB

Product Details

Blind Buried Via CEM3 PCB



Port:Shenzhen, China
Production Capacity:100000
Payment Terms:L/C, T/T, Paypal
Type:Rigid Circuit Board
Dielectric:FR-4
Material:Fiberglass Epoxy Resin + Polyimide Resin
Application:Consumer Electronics
Flame Retardant Properties:V1
Mechanical Rigid:Rigid



Product Description:

Raw materialFR-4,CEM-1,CEM-3,Rogers,Teflon etc
Layer1-20 Layer
Min.Line width/space3mil/3mil(0.075mm/0.075mm)
Min.hole size0.1mm(drilling hole)
Max.Board size1200mm*600mm
Finished board thickness0.2mm-6.0mm
Copper foil thickness18um-280um(0.5OZ-8OZ)
PTH Tolerance+/-0.075mm
NPTH Tolerance+/-0.05mm
Outline Tolerance+/-0.13mm
Surface finishedHASL/HASL lead free,Immersion Gold(ENIG)/Tin/Silver,OSP,gold plating/finger,Carbon ink,Peelable mask
Impendance Control Tolerance+/-10%
Production capability50,000 s.q.m/month



For Samples:
2L : 3 to 5 working days
4L : 3 to 7 working days
6~8L: 5 to 8 working days
10~16L: 5 to 10 working days

For Mass production:
2L : 8 to 12 working days
4L : 10 to 14 working days
6~8L: 14 to 18 working days
The final lead time based on your PO detail quantity.




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