Blind Buried Via CEM3 PCB
| Port: | Shenzhen, China |
|---|---|
| Production Capacity: | 100000 |
| Payment Terms: | L/C, T/T, Paypal |
| Type: | Rigid Circuit Board |
|---|---|
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy Resin + Polyimide Resin |
| Application: | Consumer Electronics |
| Flame Retardant Properties: | V1 |
| Mechanical Rigid: | Rigid |
Product Description:
| Raw material | FR-4,CEM-1,CEM-3,Rogers,Teflon etc |
| Layer | 1-20 Layer |
| Min.Line width/space | 3mil/3mil(0.075mm/0.075mm) |
| Min.hole size | 0.1mm(drilling hole) |
| Max.Board size | 1200mm*600mm |
| Finished board thickness | 0.2mm-6.0mm |
| Copper foil thickness | 18um-280um(0.5OZ-8OZ) |
| PTH Tolerance | +/-0.075mm |
| NPTH Tolerance | +/-0.05mm |
| Outline Tolerance | +/-0.13mm |
| Surface finished | HASL/HASL lead free,Immersion Gold(ENIG)/Tin/Silver,OSP,gold plating/finger,Carbon ink,Peelable mask |
| Impendance Control Tolerance | +/-10% |
| Production capability | 50,000 s.q.m/month |
For Samples:
2L : 3 to 5 working days
4L : 3 to 7 working days
6~8L: 5 to 8 working days
10~16L: 5 to 10 working days
For Mass production:
2L : 8 to 12 working days
4L : 10 to 14 working days
6~8L: 14 to 18 working days
The final lead time based on your PO detail quantity.
