30u Multilayer Immersion Gold PCB

30u Multilayer Immersion Gold PCB

30u Multilayer Immersion Gold PCB

Product Details

Our Services:
1.PCB Design/Copy / PCB Manufacture
2.PCB Manufacture (FR4,High TG,Rigid PCB,FPC,Aluminium)
3.Components Sourcing (100% guarantee original parts from authorized distributors)
4.PCB Assembly (SMT,DIP,BGA,QFN)

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ItemSpecification
MaterialFR-4 / Hi-Tg FR-4 /CEM-3/CEM-1/Aluminium
Layersingle layer,double layer,multi-layer(4-10)
Board Thickness0.3mm-3.0mm,+/-0.1mm(tolerance)
Copper Thickness1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5%
Impedance Control±10%
Bow and Twist MAX.0.75%(SMT)
Anti-strip0.88N/mm
Resistance≤20Ω
Reactance500V
Min. Value
Min. Trace/Space Width6 mil,+/-0.15mm(tolerance)
SMD Pitch10 mil
BGA Pitch20 mil
Min Pad Space4mil(SMT)
Plating Copper Thickness15um
Hole
Hole Size0.25mm--6.2mm
Hole Position Tolerance±0.1mm
PTH/NPTH Tolerance±0.15mm(dia.=0.4-1.4mm)
Pad Tolerance±0.1mm(dia.≥0.6mm)
Pad to hole/to pad Tolerance±0.05mm/±0.2mm
Solder Mask
Pad no Opensoldermask must cover all on both side, reject tin on pad
Pad Openreject soldermask inside the hole on both side
Solder Mask Thickness0.7mil,raised H≤0.05
Colourgreen,blue,red,yellow,black,white(LPI/MATT.,UL 94 V0 approved)
Surface Finish
HALtin height≤0.05mm
ENIGNickel 3-7um,gold:0.5-0.7um
OSP/flash gold0.2-0.5um
Pealable maskcover all on pad,thickness≥0.20mm
Carbon Inkcover all on trace,Value≤30Ω
Outline
Outline Tolerance±0.2mm
Beveling30°,45°
V-cut position/depth±0.2mm(length≤100mm)/±0.2mm
Punch±0.1mm
E-testing pass percent97% pass at the first time,+/-2%
CertificateSGS,ISO,ROHS,UL,



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