Fr4 PCB With Hard Heavy Copper

Fr4 PCB With Hard Heavy Copper

Model NO.: XZG032501 Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Brand: Xzg Board Thickness: 1.6mm Copper Thickness: 2 oz Soldermask Color: Green Silkscreen Color: White Surface Finishing: Enig Min Line W/S: 4/8 Mil Min Hole Size: 12 Mil...

Product Details

Model NO.: XZG032501

Processing Technology: Electrolytic Foil

Base Material: Copper

Insulation Materials: Epoxy Resin

Brand: Xzg

Board Thickness: 1.6mm

Copper Thickness: 2 oz

Soldermask Color: Green

Silkscreen Color: White

Surface Finishing: Enig

Min Line W/S: 4/8 Mil

Min Hole Size: 12 Mil

Trademark: XZG

Transport Package: Vaccume Package

Specification: ROHS

Origin:  China